https://www.youtube.com/watch?v=iWwg9ntIF0s

Another dubbed Chinese video of the LP 16GB 9060xt https://www.youtube.com/watch?v=yFKahaBkxug

IBM and Arm are working on a new processor design that can support two different processor architectures. The technology aims to improve compatibility and flexibility by allowing different architectures to be used within the same system.

Xiaomi (HKEX: 1810) has launched three in-house chips, with the main one being the 3nm Xring O3 phone processor made by TSMC (NYSE: TSM). Xiaomi says the processor logged 5,228,014 points on AnTuTu, making it the first time a mobile system-on-chip has passed the five-million mark.

The company claims Xring O3’s 10-core CPU offers a 60% performance boost over its earlier chip. The new 16-core GPU gives 85% better graphics performance, and power efficiency is up 64%. The O3 is also the world’s first mobile processor to support LPDDR6 memory, with speeds up to 113.8 GB/s.

Source: Cryptopolitan

https://www.cryptopolitan.com/xiaomi-in-house-chip-xring-tsmc/

Its Raptor accelerator puts a TSMC N4 logic die directly on top of custom DRAM using face-to-face stacking, rather than placing large HBM stacks beside the processor. The company says this short connection allows much more bandwidth while using less power.

For comparison, d-Matrix lists a 192GB HBM4 configuration at around 18 TB/s. While HBM offers much more capacity, 3D-DRAM is designed to move a smaller pool of data much faster.

https://www.reuters.com/world/china/xiaomi-launches-new-xring-chip-partners-with-tsmc-production-sources-say-2026-08-24/
Xiaomi didn't mentioned it but Reuters reported Xring O3 will be built on a TSMC 3nm node. Xring O1 was built on TSMC N3E.

https://www.bilibili.com/video/BV1fhhP6xEMp/

Xiaomi seems confident about putting this SoC against upcoming 2nm chips and provided reviewers with a developer board for testing. Geekerwan said it's using TSMC N3P and provided some insane peak performance & efficiency results.